IEC 60191-4 Ed. 2.2 b:2002, Mechanical standardization of semiconductor devices – Part 4: Coding system and classification into forms of package outlines for semiconductor device packages by IEC TC/SC 47D


IEC 60191-4 Ed. 2.2 b:2002, Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages by IEC TC/SC 47D

Download IEC 60191-4 Ed. 2.2 b:2002, Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages ebook by IEC TC/SC 47D

Type: pdf, ePub, zip, txt
Publisher: Multiple. Distributed through American National Standards Insti
Released: August 19, 2007
Page Count: 52
Language: English

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Description

Describes a method for the designation and the classification into forms of package outlines for semiconductor devices. Provides a systematic method for generating universal descriptive designators for semiconductor packages.... read more ...











 
 
 
 
 
 



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